| CHIPcon 2025 | |
| Inaugural Conference and Exhibition on System in Package (SiP) Technology Dates: TBD Venue: TBD, TBD, United States | ||
| Please note ! All dates are subject to changes. | ||
| The top global event for Chiplet and Heterogeneous Integration Packaging (CHIP), covering advanced technology developments and solutions, device integration strategies, and business trends.
The IMAPS CHIPcon conference will focus exclusively on innovative device integration technology developments, solutions, and business trends. CHIPcon will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, high-performance computing and networking market segments. Advanced CHIP technology is an umbrella term to cover a variety of packaging technology subsets, including laminate/glass/ ceramic/silicon/leadframe based SiP, FanOut RDL, 2.5D/3D Heterogeneous Integration, and modules. The conference will explore the current state of the art and emerging packaging technology roadmap supporting the integration and delivery of a complete system or subsystem solution. Attendees will be exposed to thought-provoking advanced package structures with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability. Website: https://www.imaps.org/ |
| Organizers | |||
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IMAPS - International Microelectronics Assembly and Packaging Society | ||
| 100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
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