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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
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IMAPS Power Electronics 2024
International Conference on Advanced Packaging for Power Electronics
5/8/2024 - 5/9/2024
IMAPS HiTEN 2024
International Conference and Exhibition on High Temperature Electronics Network
7/15/2024 - 7/17/2024
IMAPS Symposium 2024 Boston
57th International Symposium on Microelectronics
9/30/2024 - 10/3/2024
Device Packaging 2025
21st International Conference on Device Packaging
3/3/2025 - 3/6/2025
CICMT 2025
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Dates: TBD



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