| CHIPcon 2027 | |
| The Leading Event for Chiplet and Heterogeneous Integration Packaging (CHIP) Technology Dates: TBD Venue: TBD, TBD, United States | ||
| Please note ! All dates are subject to changes. | ||
| CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also in the automotive, industrial, enterprise, and consumer/client markets. The conference will examine the technical and commercial challenges faced, and what is being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem. The conference will present and examine a range of applications, user experiences, and the advanced design (DFx), simulation, packaging, test, and metrology technologies supporting this effort.
Website: https://imaps.org/ |
| Organizers | |||
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IMAPS - International Microelectronics Assembly and Packaging Society | ||
| 100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
| PC Version | About Us | |
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