ICEP 2024	Closed
	International Conference on Electronic Packaging 4/17/2024 - 4/20/2024 Venue: Toyama International Conference Center, Toyama, Japan
Please note ! All dates are subject to changes.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. Website: https://www.jiep.or.jp/icep/

Venues
	Toyama International Conference Center
	1-2 Ote-machi Toyama-city Toyama 930-0084, Toyama Japan Tel: +81-76-424 5931 https://www.ticc.co.jp/

Organizers
	Japan Institute of Electronics packaging (JIEP)
	3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/

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