3D ASIP 2017 | Closed | |
14th Annual Conference on 3D Architectures for Semiconductor Integration and Packaging 12/5/2017 - 12/7/2017 Venue: Marriott San San Francisco Airport, San Francisco CA, United States | ||
Please note ! All dates are subject to changes. | ||
The 3D ASIP conference offers a unique marketing opportunity to our sponsors. Our extensive pre-conference marketing campaign and on-site activities provide excellent exposure for your company or organization and exposure to tens of thousands of qualified industry members. Share your message during the conference with a centralized audience of senior technologists, thought leaders, and business executives in the semiconductor integration and packaging industry.
Website: http://3dasip.org/ |
Organizers | |||
IMAPS - International Microelectronics Assembly and Packaging Society | |||
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
PC Version | About Us | |
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